Tray to Reel Automatic Taping Machine TTR-400 for SMD Component Transfer and Tape-and-Reel Packaging

The TTR-400 is an automatic tray-to-reel taping machine designed to transfer SMD components from trays into carrier tape for efficient and accurate tape-and-reel packaging.

INTRODUCTION

The Tray to Reel Automatic Taping Machine TTR-400 provides a fully automated solution for transferring SMD components from JEDEC trays to carrier tape. Designed for precision, stability, and high throughput, the TTR-400 is ideal for component manufacturers and OEM/EMS factories requiring reliable tray-to-reel conversion.

Equipped with an intelligent pick-and-place system, the machine accurately picks components from trays and positions them into the corresponding carrier tape pockets. Advanced vision alignment ensures correct orientation and prevents missing or misaligned parts. With stable sealing and consistent pocket placement, the TTR-400 ensures smooth SMT feeder compatibility.

The machine supports multiple tray types, tape widths, and component sizes, making it a versatile solution for semiconductor devices, LEDs, sensors, connectors, microchips, and other SMD products. Its automated workflow reduces labor input while increasing packaging consistency, throughput, and traceability.

TECHNICAL DATA

Parameter Name Parameter Value
Placement Speed UPH 1500~5000
Production output 12~56mm
Dimensions D 1100mm x W 1000mm x H 1550m
Weight 350KG

APPLICATION

The TTR-400 is designed for tape-and-reel packaging in industries that frequently use tray-loaded components, such as:

Semiconductor Devices

QFN, DFN, SOP, BGA, MOSFETs, small IC packages.

Optoelectronic & LED Components

LED chips, photodiodes, optical sensors.

Precision Sensors & MEMS Devices

MEMS chips, hall sensors, micro sensors.

Connector & Mechanical Parts

Micro connectors, metal terminals, stamped parts.

OEM / EMS Manufacturing

Factories requiring automated tray-to-reel conversion for SMT mass production.

The TTR-400 offers high accuracy, reliable automation, and strong adaptability, making it a powerful tool for improving productivity and packaging quality in modern electronic manufacturing.

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